Server Manufacturing Levels Defined
服務器的(de)ODM,OEM為了分工協作，開發出(chu)各(ge)(ge)種各(ge)(ge)樣的(de)商業模(mo)式(shi)和交付方(fang)式(shi)，分為L1-L12
目前品牌商使用L9 或者(zhe)L6 的比較多,平時較為(wei)常見.
L1：零(ling)件制造 - 包括非涂漆零(ling)件和零(ling)部(bu)件級別的模具(ju)制造。
L2：零(ling)件子裝(zhuang)配 - 進行一定程度的組裝(zhuang)。
L3：金屬(shu)和塑料(liao)材料(liao)組合在(zai)一起，作為一個機箱(xiang)（即底盤）發貨。
L4：金屬(shu)和(he)塑料材料+電(dian)源單元（PSU）和(he)/或(huo)扁(bian)平電(dian)纜(lan)和(he)/或(huo)背板作為套件或(huo)袋裝發貨。
L5：所有等級 4 的機(ji)箱部件連接，集成(cheng)電(dian)纜，進行輸入/輸出(chu)測試。
L6：將主板集成到機箱(xiang)內并進行(xing)上電(dian)測(ce)試。
L6 生(sheng)產(chan)的(de)(de)平(ping)臺是 ODM（原(yuan)始設計制(zhi)造(zao)商(shang)(shang)）提供的(de)(de)“裸機服務器(qi)”，這(zhe)些(xie)服務器(qi)是集成(cheng)的(de)(de)主板/機箱組合，其中(zhong)包含(han)零件，但(dan)缺少 CPU、內存(cun)、硬(ying)盤、網絡卡等(deng)組件。通常(chang)，系統集成(cheng)商(shang)(shang)會(hui)購買這(zhe)些(xie)裸機，并(bing)添加組件以(yi)創建特定的(de)(de)服務器(qi)配置。系統集成(cheng)商(shang)(shang)能夠(gou)在下(xia)一(yi)等(deng)級中(zhong)添加多少價值和(he)服務，取決于其在以(yi)下(xia)等(deng)級中(zhong)的(de)(de)能力：
L7：將插卡集成到裸機服(fu)務(wu)器，并(bing)具備(bei)測試能力。
L8：將硬盤集成(cheng)到裸機服務器，并具備(bei)測試能(neng)力。
L9：將 CPU 和內(nei)存集成到裸機服務器，并具備測試能(neng)力。
L10：完(wan)(wan)整組裝服(fu)務(wu)器，并進行全系(xi)統和(he)零部件(jian)級別的測試、操作(zuo)系(xi)統/軟件(jian)集成(cheng)，以(yi)及包(bao)含用戶(hu)手冊(ce)和(he)其他所(suo)需文件(jian)的產(chan)品組裝，交付成(cheng)為完(wan)(wan)全集成(cheng)的服(fu)務(wu)器解決(jue)方案。
能夠生產等級(ji) 10 的(de)(de)制造商將提(ti)供一個(ge)可工作的(de)(de)服務(wu)器解決(jue)方案(an)(an)。但是，如(ru)果需(xu)要(yao)將多(duo)臺服務(wu)器網絡連接在一起，形成機(ji)架(jia)級(ji)別(bie)甚(shen)至(zhi)多(duo)機(ji)架(jia)級(ji)別(bie)的(de)(de)解決(jue)方案(an)(an)，則(ze)至(zhi)少(shao)需(xu)要(yao)等級(ji) 11 的(de)(de)制造商（如(ru) AMAX）：
等級 11：節(jie)點(dian)(dian)級組(zu)裝(zhuang)、測(ce)試，所有服務(wu)器(qi)節(jie)點(dian)(dian)的(de)(de)(de)操作系統/軟(ruan)件加(jia)載，然后將節(jie)點(dian)(dian)組(zu)裝(zhuang)到機(ji)架中，包(bao)括(kuo)完整的(de)(de)(de)電纜網絡連接（包(bao)括(kuo)交換機(ji)），并(bing)進行(xing)機(ji)架級別(bie)(bie)或多機(ji)架級別(bie)(bie)的(de)(de)(de)完整解決(jue)方案(an)測(ce)試。
等(deng)級 12：在(zai)等(deng)級 11 的(de)(de)基礎上，進(jin)行機架(jia)到多機架(jia)級別的(de)(de)制造，包括所(suo)有(you)網絡(luo)(luo)連接，完整的(de)(de)軟件加(jia)載、驗(yan)證和優化。這(zhe)可能包括但不限于群集(ji)管(guan)理、云(yun)操作系(xi)統（如(ru) OpenStack）和網絡(luo)(luo)軟件。
Level 1: Parts manufacturing — this includes non-painted parts and molding parts on the component level.
Level 2: Piece Parts Sub Assembly — some level of assembly.
Level 3: Metals and plastics are integrated together and shipped as a case (i.e. chassis).
Level 4: Metals and Plastics + PSU and/or Flat Cable and/or Backplane are shipped as a kit or bag.
Level 5: All enclosure parts from Level 4 attached, cables integrated, I/O tested
Level 6: Integration of motherboard into chassis enclosure and power on test.
Level 6 manufactured platforms are what ODMs provide when they ship out “server barebones” which are integrated motherboard/chassis combinations with parts included, but missing components such as CPU, memory, hard drives, networking cards, etc. Often systems integrators will buy these barebones and populate with components to create specific server configurations. How much value that integrator can add in terms of services and further building out the solution depends on their capabilities in the next levels:
Level 7: Integration of add-on cards into server barebone with ability to test.
Level 8: Integration of hard drives into server barebone with ability to test.
Level 9: Integration of CPU and memory into server barebone with ability to test.
Level 10: Full assembly of server with full system and component level testing, OS/software integration, product kitted with user manual and other required documentation and delivered as a fully-integrated server solution.
A manufacturer capable of up to Level 10 manufacturing will deliver a working server solution. But if you need multiple servers networked together as a rack-level or even multi-rack level solution, you will need at least a Level 11 manufacturer (like AMAX):
Level 11: Node-level assembly, testing, OS/software loading of all server nodes followed by rack cabinet assembly of nodes into racks with full cable networking (including switches), and tested as a working total solution at the rack or multi-rack level.
Level 12: Rack to multi-rack level manufacturing featured in Level 11 including all networking with full software loading, validation and optimization. This may include but is not limited to cluster management, cloud OS (such as OpenStack) and networkingsoftware.
